3PB1001

Product Accelerator Board

Caratteristiche

  • Ready to use solution: start developing your product now
  • Can be integrated in your product as-is or used as a starting point for a customization
  • High performance, ready for IA-driven future
  • Powerful graphic performance, ideal to create next-generation HMIs
  • Ideal for multimedia applications
  • Supports all NXP i.MX8M Plus processor variants
  • Compatible with future 3SM1010 i.MX9 SoM Modules
  • Compact dimensions only 160 x 100 mm
  • Supports 3SM1009 SoM Modules
  • Flexible and expandable solution
  • EGF SW Upgrade platform for updates through USB pendrives or OTA

SOM Module

  • CPU

    • NXP i.MX 8M Plus Solo\Dual\Quad Arm® Cortex®-A53 core
    • Standard or Lite CPU options
    • Neural Processing Unit (NPU) option
    o 2.3 TOP/s Neural Network performance
    • Supports Arm® Cortex®-A53 core frequency up to 1800 MHz
    • Additional Cortex-M7 Core up to 800 MHz

  • STORAGE / BOOT MEMORY

    • From 8 to 64 GB eMMC Flash memory

  • DRAM MEMORY

    • Up to 4GB LPDDR4 memory with 32 bit wide Bus

Carrier Board

  • MULTIMEDIA AND HUMAN INTERFACE

    • 3 display connectors available:
    o HDMI display
    o LVDS display
    o MIPI or secondary LVDS display
    • 2 camera connectors available
    o MIPI-CSI Camera Interface (4-lane) with HDR ISP
    • Integrated Audio Codec
    o Multifunctional Headphone Jack with Mic
    • SPDIF available on Expansion Connector
    • 7”, 10.1”, 15.6” and other custom size displays available on request

  • SYSTEM

    • Single +12 / 24 VDC ±5% power supply
    • On board regulators for all integrated functions
    • Power consumption depends on application

  • I/O PERIPHERALS

    • 2 x USB 3.1 Host Connectors
    • 1 x microSD card Connector
    • 1 x M.2 key M for external SSD (optional)
    • 1 x M.2 key E Connector for Wifi / BT Modules
    • 1 x microUSB Debug UART connector to simplify SW debugging
    • Up to 4 x RS-232 UART Interfaces
    • Up to 2 x CAN FD Interfaces (with integrated transceiver)
    • Onboard RTC
    • Up to 2 x Gigabit LAN Interfaces
    • Expansion connector for I2C / PWM and GPIOs

  • TEMPERATURE 1

    • 0 to 70°C for commercial version
    • -40 to 85°C for industrial version

  • OPERATING SYSTEM

    • Linux (Cortex® – A53 core) + FREERTOS (Cortex® – M7)

1 These temperatures are the ambient operating temperature ranges for the components used into SoM, with exception of iMX8M Plus processor, which is specified on junction operating temperature range, 0-95°C for commercial version and -40-105°C for industrial version. SoM ambient operating temperature depends on the application and on the cooling measures applied.

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Downloads

Brochures

BOARD DIAGRAM

Dimensions (mm)

Ordering Options

Default Configuration:

3PB10011A1B1C1A1A1A1 i.MX 8M Plus Quad NPU, 1GB LPDDR4, 8GB eMMC, 2 Gigabit LAN Ports, HDMI, Single LVDS and MIPI-DSI, SE050, ATECC608A, 2 CAN FD, 2 USB Host, M.2 Key E, M.2 Key M, 2 MIPI Camera Connector, Audio, Exp Connector, Commercial Range

Some code combinations are not allowed and others are available on customizations only, for more information please contact Elettronica GF sales dept.

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