3SB2000 series NXP i.MX6ULL Ultra Low Cost Single Board Computer

3SB2000

Single Board Computer NXP i.MX6ULL

Caratteristiche

  • Ultra-Low cost solution
  • High scalability and flexibility solution
  • Powered with NXP i.MX6ULL processors
  • Compact dimension only 107x67mm
  • Fanless solution
  • CPU

    • NXP i.MX6ULL single ARM® Cortex®-A7 core
    • Frequency up to 900 MHz

  • MEMORY

    • Up to 1GB DDR3L

  • STORAGE / BOOT1

    • Up to 64 GB eMMC
    • QSPI FLASH 16 Mb
    • Slot microSD (alternative to eMMC)

  • I/O PERIPHERALS

    • Wi-Fi 802.11 b/g/n and BLE
    • USB 2.0 OTG
    • USB 2.0 Host
    • Ethernet 10\100Mbps
    • UART port configurable by SW to RS-232 or RS-485
    • Buzzer
    • RTC

  • I/O PERIPHERALS EXPANSION CONNECTOR12

    • I2C x 2
    • SPI x 2
    • S/PDIF
    • SAI – I2S audio port
    • Up to 8 ADC inputs
    • PWM x 7
    • Timer GPT x 2
    • 8-bit Parallel CSI
    • Touch controller to support 4-wire and 5-wire
    • 24-bit Parallel LCD
    • CAN
    • UART x2
    • SDIO
    • GPIO x 30
    • JTAG
    • Power on/off button
    • Power input/output

  • SYSTEM

    • Dimension 107x67mm
    • Single +12/24 VDC power supply
    • Power consumption depends on CPU frequency / state

  • TEMPERATURE3

    • 0 to 85°C for Commercial plus Grade
    • -40 to 85°C for Industrial Grade

  • OPERATING SYSTEMS

    • Linux

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1 Please note that not all the functions may be available simultaneously, due to pin mux limitation of both i.MX6ULx part numbers used and expansion connectors restrictions. For more information, refer to user’s manual.

2 These functions require transceiver or additional circuitry on expansion board.

3 These temperatures are the ambient operating temperature ranges for the components used into 3HI2000 series, with exception of iMX6ULx processors, which are specified on junction operating temperature range, 0÷95°C for Commercial Grade and -40÷105°C for Commercial Extended Grade. 3HI2000 series ambient operating temperature depends on the application and on the cooling measures applied.

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