SoM 3SM1002 AM335x ARM Cortex-A8

3SM1002

Texas AM335x ARM Cortex-A8

Caratteristiche

  • AM335x ARM® Cortex®-A8 CPU
  • High pin multiplexing flexibility on MXM 230 pin connector
  • HW support for  EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™
  • Low power consumption
  • Small dimensions only 40 mm x 70 mm

La serie 3SM1002 è basata sul processore  Texas Instruments AM335x, questo SOM  include un core ARM Cortex-A8 con frequenze di clock fino a 720MHz ed integra i più diffusi protocolli per l’automazione industriale tra cui EtherCAT®, PROFIBUS, PROFINET, EtherNet/IP™. I moduli AM335x  di ElettronicaGF sono progettati per ridurre i tempi di sviluppo e i costi della carrier board. Nonostante le dimensioni molto contenute, tutte le periferiche comunemente utilizzate sono già integrate sul modulo, per esempio: – fino a 512MB DDR3 RAM – LAN 10/100/1000 – uscita video parallela – SDIO,I2C,SPI bus – porte USB OTG- connettore JTAG per debug L’uso di una singola alimentazione, inoltre, semplifica enormemente il progetto e l’industrializzazione  della carrier board.  I moduli AM335x supportano il sistema operativo Linux.

  • CPU

    • Texas AM335x series ARM® Cortex®-A8 CPU Microprocessor with NEON™ SIMD coprocessor
    • Crypto Hardware Accelerators

  • MEMORY

    • Up to 512 MB DDR3-800 (16 bit BUS)

  • STORAGE*

    • Up to 512 MB NAND FLASH memory (optional)
    • SPI FLASH 2 MB (optional)
    • Up tp 64GB eMMC (optional)
    • microSD Connector (optional)

  • MULTIMEDIA AND HUMAN INTERFACE*

    • 1x SGX530 3D Graphics Engine (optional)
    • 1x Integrated LCD controller (Max Supported Resolution: up to 2048×2048) for an external 24 bpp TTL Display
    • 1x Touch Screen interface (resistive)

  • I/O PERIPHERALS*

    • 1x General-Purpose Memory Controller Bus (GPMC)
    • 2x USB OTG 2.0 LS/FS/HS
    • 1x Full Ethernet 10/100 BASE-T with on board PHY (optional)
    • 2x 10/100/1000 RGMII Ethernet interfaces
    • 2x CAN BUS Interfaces
    • 6x UART (TX,RX,RTS,CTS) TTL Level
    • 2x Multichannel Audio Serial Interfaces (McASP)
    • 2x SPI Interfaces (McSPI)
    • 3x I2C BUS Interfaces
    • 8x ADC Input (12 bit SAR)
    • 3x Enhanced Capture Rate Modules (eCAP)
    • 3x Enhanced High-Resolution PWM Modules (eHRPWM)
    • 3x MMC, SD, and SDIO Ports

  • SYSTEM

    • 230 pin MXM connector
    • Single +5 VDC ±10% power supply
    • Integrated regulators for all integrated functions
    • Power consumption depends on MPU clock
    frequency / state
    • RTC 32 kHz (optional)
    • Temperature Sensor (optional)

  • TEMPERATURE**

    • 0 to +70°C for commercial version
    • -40 to +85°C for industrial version

  • OPERATING SYSTEMS

    • Linux

*Please note that all function may not be available simultaneously, due to pin muxing limitation of SOM connector restrictions. Function availability depends also on the installed processor. For more details refer to processor datasheet.

**Appropriate cooling measures must be provided.

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brochures

 

3sm1002_ordering_information

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