3SM1007

• CPU

  • NXP i.MX7  Solo/Dual ARM® Cortex®-A7 CPU + ARM® Cortex®-M4 CPU
  • Heterogeneous Multicore Processing architecture
  • A7 processors Frequency up to 1200 MHz
  • M4 processor Frequency 266 MHz

• MEMORY

  • Up to 2 GB DDR3L up to 1066MHZ (32 bit)

• STORAGE*

  • SPI Nor Flash for bootloaders
  • Up to 512 MB NAND FLASH memory (optional)
  • Up to 64 GB eMMC 5.0 (optional)
  • QSPI signals available on edge connector

• MULTIMEDIA AND HUMAN INTERFACE*

  • Image processing PXP, v3.0
  CSC, Resize, Combine, Rotate
  HW Dithering, Basic 2D Blit
  • RGB 24 bit parallel display output
  • MIPI-DSI display output
  • EPDC display output
  • Two lane MIPI-CSI camera input

• I/O PERIPHERALS*

  • 2 x USB 2.0 OTG + Integrated PHY
  • 1 x USB 2.0 HSIC port
  • 2 x Ethernet 10/100/1000 with on board PHY (optional)
  • Up to 2 x FLEXCAN BUS Interfaces
  • Up to 7 x UART TTL Level
  • Up to 3 x SPI Interfaces
  • Up to 3 x I2C BUS Interfaces
  • Up to 2 x SDIO Bus
  • 8 x ADC input
  • 1x Full WEIM interface (27 bit address, 16 bit data, 4 CS)
  • Up to 2 x I2S interface
  • Up to 3 x PWM outputs
  • 1 x PCIe x1 output (optional)
  • GPIOs available

• SYSTEM

  • Edge connector 230 pin MXM + JTAG Connector
  • Single +3.3 VDC ±5% supply
  • On board regulators for all integrated functions
  • Power consumption depends on MPU clock
  frequency / state
  • RTC integrated in i.MX7 Application processor

• TEMPERATURE**

  • 0 to +70°C for Commercial version
  • -20 to +85°C for Extended version

• OPERATING SYSTEMS

  • Linux

^*Please note that all function may not be available simultaneously, due to pin muxing limitation of SOM connector restrictions. Function availability depends also on the installed processor. For more details refer to processor datasheet.

^**Appropriate cooling measures must be provided.